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Release time:2025-07-11
Modern electronic systems require ventilation plate that simultaneously permit thermal management and block electromagnetic interference (EMI). The electromagnetic shielding materials integrated into ventilation plate exhibit unique characteristics to address this dual requirement. These specialized materials must maintain structural integrity while fulfilling contradictory needs - allowing air passage yet blocking electromagnetic waves.
The electromagnetic shielding materials in ventilation plate typically employ conductive metals or composite polymers. Metallic meshes, particularly those with optimized aperture geometries, demonstrate high shielding effectiveness (SE) while preserving 30-70% open area for airflow. The electromagnetic shielding materials' conductivity directly correlates with their ability to reflect high-frequency EMI.
A critical feature of electromagnetic shielding materials in ventilation plate is their environmental resilience. Unlike solid shields, these perforated materials face accelerated degradation from moisture infiltration and particulate accumulation. Advanced electromagnetic shielding materials now integrate hydrophobic coatings or self-healing conductive polymers to maintain performance in harsh conditions. The electromagnetic shielding materials must also accommodate mechanical stresses - ventilation plate experience vibration-induced micro-fractures that can compromise EMI protection through gap formation.
The electromagnetic shielding material embedded in the ventilation plate represents a complex compromise between competing physical requirements. MAT's continuous innovation in materials and technology has solved the problems of ultra-high frequency shielding and environmental durability. With the development of technology, electronic systems are becoming increasingly compact and powerful, and the role of these specialized electromagnetic shielding materials in ventilation panels is becoming increasingly important for reliable operation across industries.